本发明提供用于一光子芯片之系统、方法及设备。该光子芯片除包含一或多个光学组件外亦包含一或多个电子组件。可使用光栅耦合器以使自一光纤或激光入射之光与该光子芯片上之该等光学组件耦合。该等光栅耦合器可经设计以具有一宽带宽以支持诸如分波多任务(WDM)之应用。该宽带宽可借由以下者而达成：减小入射于该等光栅耦合器上之光束之一模态场直径(MFD)，且将该等光学耦合器之一光束大小选择为实质上等于MFD。该带宽可借由使用薄硅层来制造该光栅耦合器之嵴而进一步改良。可利用具有相对大的光束大小之光栅耦合器以使由激光输出之光与该芯片上之该等光学组件耦合。

This disclosure provides systems, methods, and apparatus for a photonic chip. The photonic chip includes one or more electronic components in addition to one or more optical components. Grating couplers can be utilized for coupling light incident from an optical fibers or lasers with the optical components on the photonic chip. The grating couplers can be designed to have a wide bandwidth to support applications such as wave division multiplexing (WDM). The wide bandwidth can be achieved by reducing a mode field diameter (MFD) of the light beams incident on the grating couplers, and selecting a beam size of the optical couplers to be substantially equal to MFD. The bandwidth can be further improved by using thin silicon layer for fabricating the ridges of the grating coupler. Grating couplers with relatively large beam sizes can be utilized for coupling light output by lasers with the optical components on the chip.