本发明提供一种导电凸块总成，其可包括一钝化基板。该导电凸块总成亦可包括一导电凸块垫，该导电凸块垫由该钝化基板支撑且由一第一钝化层开口包围。该导电凸块总成可进一步在该钝化基板上包括一第二钝化层开口。该第二钝化层开口可在接近该钝化基板之一边缘处与包围该导电凸块垫之该第一钝化层开口合并。该导电凸块总成亦可在该导电凸块垫上包括一导电凸块。

A conductive bump assembly may include a passive substrate. The conductive bump assembly may also include a conductive bump pad supported by the passive substrate and surrounded by a first passivation layer opening. The conductive bump assembly may further include a second passivation layer opening on the passive substrate. The second passivation layer opening may be merged with the first passivation layer opening surrounding the conductive bump pad proximate an edge of the passive substrate. The conductive bump assembly may also include a conductive bump on the conductive bump pad.