本发明揭露了一种用于半导体设备之接合线式散热结构，其一实施例包含：一半导体基板；一热源，位于该半导体基板或属于该半导体基板，包含至少一热点；至少一热导层；至少一热导体，用来连接该至少一热点与该至少一热导层；至少一散热体，处于一电性浮接状态；以及至少一接合线，用来连接该至少一热导层与该至少一散热体，借此将该热源之热传导至该散热体。

The present invention discloses a bonding-wire-type heat sink structure applicable to semiconductor devices. An embodiment of the said bonding-wire-type heat sink structure comprises: a semiconductor substrate; a heat source, which is on/in the semiconductor substrate or pertains to the semiconductor substrate, including at least one heat point; at least one heat-conduction layer; at least one heat conductor operable to connect the at least one heat point with the at least one heat-conduction layer; at least one heat dissipation element in an electric floating state; and at least one bonding wire operable connect the at least one heat-conduction layer with the at least one heat dissipation element, so as to transmit the heat of the heat source to the heat dissipation element.