一种堆栈式封装设备的制造方法：(i)接收前驱物封装，前驱物封装包括前驱物基板及前驱物基板上之复数个半导体封装，其中在前驱物基板与半导体封装之每一者之间存在缝隙；(ii)形成填充缝隙之底部封胶材料；(iii)沿着半导体封装之相邻多者之间的区域切割前驱物基板，以形成复数个离散的堆栈式封装设备；以及(iv)将补充底部封胶材料应用至该等堆栈式封装设备中的一个堆栈式封装设备。

A method of manufacturing a package-on-package device includes the following operations: (i) receiving a precursor package including a precursor substrate and a plurality of semiconductor packages on the precursor substrate, in which a gap is presented between the precursor substrate and each of the semiconductor packages; (ii) forming underfill material filling the gaps; (iii) cutting the precursor substrate along a region between adjacent ones of the semiconductor packages to form a plurality of discrete package-on-package devices; and (iv) applying supplemental underfill material to one of the package-on-package devices.