在此揭露的是具有设置在金属化堆栈中的三维电容器之电子组件，以及相关方法及设备。在某些实施例中，例如，一电子组件可包括：一金属化堆栈及设置在该金属化堆栈中之一电容器，其中该电容器包括具有多数凹部之一第一导电板、及具有多数突起之一第二导电板，其中该等多数突起中之个别突起延伸进入该等多数凹部中之对应个别凹部且未接触该第一导电板。

Disclosed herein are electronic components having three-dimensional capacitors disposed in a metallization stack, as well as related methods and devices. In some embodiments, for example, an electronic component may include: a metallization stack and a capacitor disposed in the metallization stack wherein the capacitor includes a first conductive plate having a plurality of recesses, and a second conductive plate having a plurality of projections, wherein individual projections of the plurality of projections extend into corresponding individual recesses of the plurality of recesses without contacting the first conductive plate.