本发明描述了一种将可流动材料填充到半导体组件模块之间隙区域中的方法。在一个实施例中，在基板上形成复数半导体单元以产生数组模块；数组模块附接到一背板，该背板具有形成半导体组件模块的电路，其中在半导体组件模块内部形成复数个间隙区域，并且间隙区域边缘形成环绕在组件模块的边缘；借由运行高作用压力环境让可流动材料强制在间隙区域内，然后固化成稳定的固体以形成牢固结构。通过使用一基板去除进程去除基板来形成半导体转换模块。通过利用半导体转换模块上的连接层形成半导体驱动模块。在一个实施例中，形成垂直发光二极管半导体驱动模块来点亮垂直LED数组。在另一个实施例中，形成复数个颜色发射二极管半导体驱动模块以显示彩色图像。在另一个实施例中，形成具有复数个功能半导体驱动模块的复数个图案的半导体单元，以提供多种功能用于期望应用。

A method to fill the flowable material into the semiconductor assembly module gap regions is described. In an embodiment, multiple semiconductor units are formed on the substrate to create an array module; the array module is attached to a backplane having circuitry to form the semiconductor assembly module in which multiple gap regions are formed inside the semiconductor assembly module and edge gap regions are formed surround an edge of the assembly module; the flowable material is forced inside the gap regions by performing the high acting pressure environment and then cured to be a stable solid to form a robustness structure. A semiconductor convert module is formed by removing the substrate utilizing a substrate removal process. A semiconductor driving module is formed by utilizing a connecting layer on the semiconductor convert module. In one embodiment, a vertical light emitting diode semiconductor driving module is formed to light up the vertical LED array. In another one embodiment, multiple color emissive light emitting diodes semiconductor driving module is formed to display color images. In another embodiment, multiple patterns of semiconductor units having multiple functions semiconductor driving module is formed to provide multiple functions for desire application.