本发明涉及一种具有均匀厚度之改良的电解铜箔及制造该电解铜箔的方法。该电解铜箔通常具有横越于该电解铜箔的横截面区域之1至4个界面线，及小于2.0%之重量偏差。本发明复涉及用于制造电解铜箔的方法，其包括添加一或多个绝缘遮罩于尺寸稳定阳极的表面上。该绝缘遮罩被切割以对应于该电解铜箔的变化区域，使得该绝缘遮罩产生对电沉积过程的干扰以平均该变化。

The present disclosure relates to an improved electrodeposited copper foil having uniform thickness and methods for manufacturing the electrodeposited copper foil. The electrodeposited copper foil typically has one to four interfacial lines through the cross-sectional area of the electrodeposited copper foil and a weight deviation less than 2.0%. The disclosure also relates to a process for making the electrodeposited copper foil that includes the addition of one or more insulative masks to the surface of a dimensionally stable anode. The insulative mask is cut to correspond to areas of variation in electrodeposited copper foil, such that the insulative mask causes interferences with the electrodeposition process to even out the variation.