本发明揭示一种用于制造一射频(RF)模块之方法，该方法包括：形成或提供包括一封装基板及经装配于其上之一RF组件之一第一总成，该第一总成进一步包括关于该RF组件而形成之一或多个屏蔽焊线；及在该封装基板上方形成一外模，以基本上囊封该RF组件及该一或多个屏蔽焊线，借由包括在一方向上减小经熔化树脂之一体积之压缩模制而形成之该外模制具有垂直于由该封装基板定义之一平面之一组件。

A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.