一种半导体设备特别薄型半导体封装体，其可降低且同时达到均匀一致的安装高度，无需复杂的安装个别芯片之步骤，改善制造良率，达成半导体设备之一致高度，而不受芯片厚度变化的影响以及可全部一起运行电测试；以及一种制造该种半导体设备之方法，其中一个半导体其背面暴露向上而安装于绝缘带状基板顶面上，该带状基板具有通孔于其厚度方向，半导体组件侧面周围区系藉密封树脂层密封，形成以带状基板底面上的金属互连层界定带状基板之通孔底部，一层其厚度方向有通孔之耐焊层覆盖金属互连层及带状基板底面，由半导体组件之活性面向下伸展之链接端子插入带状基板之通孔内，传导性材料组成之填料填补链接端子与带状基板通孔间之间隙，而将链接端子与金属互连层电链接。

A semiconductor device, in particular a thin semiconductor package, which reduces and simultaneously achieves a uniform mounting height, does not require complicated steps for mounting individual chips, improves the manufacturing yield, achieves a uniform height of the semiconductor device without being affected by the variation in thickness of the chip, and enables execution of an electrical test all together, and a process for production of the same, wherein a semiconductor is mounted, with its back surface exposed upward, on the top surface of an insulating tape substrate having through holes in the thickness direction, the area around the side surfaces of the semiconductor element is sealed by a sealing resin layer, metal interconnections formed on the bottom surface of the tape substrate define the bottom portions of the through holes of the tape substrate, a solder resist layer having through holes in the thickness direction covers the bottom surface of the metal interconnections and the tape substrate, connection terminals extending downward from the active surface of the semiconductor element are inserted into the through holes of the tape substrate, a filler comprised of a conductive material fills the gaps between the connection terminals and the through holes of the tape substrate, and the connection terminals and the metal interconnections are electrically connected.