本发明系一种电子设备之制造方法，该电子设备包含由绝缘性陶瓷基板及覆盖该陶瓷基板表面之覆盖构件所构成之框体，且该框体内部安装有至少一个电子组件。该制造方法包含以下步骤：藉烧固含有无机粉末及黏合剂之复合物而制造出平板状陶瓷基板后，将该陶瓷基板依照预定之设备设计进行形状加工，并于业经赋予形状之陶瓷基板之表面形成金属化层，接着于该陶瓷基板之预定范围安装电子组件，然后更以覆盖构件密封该陶瓷基板。

Method for producing an electronic device comprising a housing constituted from an insulating ceramic substrate and a lid member covering a surface of the ceramic substrate, at least one electronic element being packaged in an interior of the housing. The electronic device is produced by preparing a plate-like ceramic substrate through sintering of a composite containing inorganic powders and a binder, followed by fabricating the ceramic substrate in accordance with a predetermined design of the device, forming a metalized layer on a surface of the shaped ceramic substrate, packaging an electronic element in a predetermined area of the ceramic substrate, and sealing the substrate with a lid member.