本发明之目的是增加焊盘部和外部端子之接合力，确实防止脱落，经过长期间亦可确保连接之可靠度。本发明之半导体设备系在半导体组件1上形成使金属布线7a间绝缘之绝缘树脂层4，金属布线之端部连接到半导体组件上之电极2，以金属布线之另一端部作为，与焊盘之外部端子9连接，除了焊盘之连接部份外，以表层树脂层8覆盖，在焊盘之至少1个之焊盘部7b之上面设有突起部10。利用此种方式，在焊接时外部端子从周围固定焊盘部之突起部，可以确实地连接外部端子和焊盘部。其结果是可以获得经过长期间亦可以确保连接可靠度之半导体设备。

There is provided a semiconductor device in which the junction strength of land portions and external terminals is increased, the disconnection of the external terminal is surely prevented, and the connection reliability is ensured over an extended period of time. An insulating resin layer 4 which insulates metal wires 7a from one another is formed on a semiconductor element 1, an end portion of the metal wire is connected to an electrode 2 on the semiconductor element, the other end portion of the metal wire is connected to an external terminal 9 to form a land, the entire surface of the semiconductor element except the connecting portions of the lands is covered with a surface-layer resin layer 8, and a projection 10 is provided on the top surface of a land portion 7b of at least one of the lands. Because of this, after their soldering, the external terminal holds the perimeter of the projection on the land portion, so that the external terminal can be surely connected to the land portion. As a result, the semiconductor device which ensures their connection reliability over an extended period of time can be obtained.