Invention Patent
- Patent Title: 封裝載板
- Patent Title (English): Package carrier
- Patent Title (中): 封装载板
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Application No.: TW101143964Application Date: 2012-11-23
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Publication No.: TWI489918BPublication Date: 2015-06-21
- Inventor: 王金勝 , WANG, CHIN SHENG , 陳建銘 , CHEN, CHIEN MING
- Applicant: 旭德科技股份有限公司 , SUBTRON TECHNOLOGY CO., LTD.
- Applicant Address: 新竹縣
- Assignee: 旭德科技股份有限公司,SUBTRON TECHNOLOGY CO., LTD.
- Current Assignee: 旭德科技股份有限公司,SUBTRON TECHNOLOGY CO., LTD.
- Current Assignee Address: 新竹縣
- Agent 詹銘文; 葉璟宗
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/18 ; H01L23/485
Public/Granted literature
- TW201422075A 封裝載板 Public/Granted day:2014-06-01
Information query
