- 专利标题: Multi-layer capacitor package and package housing
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申请号: US15063753申请日: 2016-03-08
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公开(公告)号: US10002712B2公开(公告)日: 2018-06-19
- 发明人: Su-Jeong Seo , Tae-Yoo Kim , Jung-Kab Park , Young-Il Song , Jin-Ha Shin , Jungwoo Lee , Younglae Cho , Byung-Wook Ahn , Jung-Ho Park , Sook-Young Yun , Seung-Bin Baeg , Young-il Na
- 申请人: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- 申请人地址: KR Suwon-si
- 专利权人: Research & Business Foundation Sungkyunkwan University
- 当前专利权人: Research & Business Foundation Sungkyunkwan University
- 当前专利权人地址: KR Suwon-si
- 代理机构: NSIP Law
- 优先权: KR10-2015-0032473 20150309
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/224 ; H01G4/012 ; H01G4/232
摘要:
Disclosed is a multi-layer capacitor package comprising: a multi-layer capacitor; connection electrodes coupled to capacitor electrodes respectively, wherein the connection electrodes in each group of the connection electrodes vertically overlap with each other, and first and second groups of the connection electrodes are horizontally spaced from each other; a package housing configured to receive therein the multi-layer capacitor; and first and second internal electrodes received in the housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.
公开/授权文献
- US20160300663A1 MULTI-LAYER CAPACITOR PACKAGE AND PACKAGE HOUSING 公开/授权日:2016-10-13