Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15407839Application Date: 2017-01-17
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Publication No.: US10002969B2Publication Date: 2018-06-19
- Inventor: I-Sheng Chen , Chih Chieh Yeh , Cheng-Hsien Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L29/06 ; H01L29/423 ; H01L29/24 ; H01L29/267 ; H01L29/16 ; H01L29/161 ; H01L29/165 ; H01L29/78

Abstract:
A semiconductor device includes channel layers disposed over a substrate, a source/drain region disposed over the substrate, a gate dielectric layer disposed on and wrapping each of the channel layers, and a gate electrode layer disposed on the gate dielectric layer and wrapping each of the channel layers. Each of the channel layers includes a semiconductor wire made of a first semiconductor material. The semiconductor wire extends into the source/drain region. The semiconductor wire in the source/drain regions is wrapped around by a second semiconductor material.
Public/Granted literature
- US20170155001A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-06-01
Information query
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