A sealable laser diode heat sink module for a laser diode includes an anode assembly and a cathode assembly having a cathode base and a cathode connector plate. The anode assembly includes an anode base configured to house the laser diode and the cathode base within a sealable cavity recessed into the anode base. The anode base has a cathode base opening configured to receive the cathode connector plate. An anode connector plate extends from the anode base. An anode current path passes through the laser diode and the anode connector plate via direct connections through the anode base. A cathode current path passes through the cathode connector plate passes via direct connections through the cathode base. The anode base is configured to dissipate heat from the laser diode.