Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US15345571Application Date: 2016-11-08
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Publication No.: US10008331B2Publication Date: 2018-06-26
- Inventor: Jun Ikeda , Kota Zenzai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-251277 20141211
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/232 ; H01G4/012 ; H01G4/12 ; H01G4/248 ; H01G4/005 ; H01G4/228

Abstract:
A multilayer ceramic electronic component includes a ceramic element body including internal electrodes and external electrodes electrically connected to respective internal electrodes. Each of the external electrodes includes a sintered metal layer including glass and metal and a conductive resin layer including resin and metal particles. In a cross section of the multilayer ceramic capacitor, at an interface between the sintered metal layer and the conductive resin layer, recesses having a shape in which a dimension of an inner portion is larger than a dimension of an inlet are present, and L1/L2 is about 0.2 or more and about 1.5 or less, where L1 is a length along the interface at which the glass of the sintered metal layer is exposed at the interface, and L2 is a length along the interface at which the metal of the sintered metal layer is exposed at the interface.
Public/Granted literature
- US20170053743A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2017-02-23
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