- 专利标题： Stacked-die including a die in a package substrate
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申请号： US13629368申请日： 2012-09-27
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公开(公告)号： US10008475B2公开(公告)日： 2018-06-26
- 发明人: Chia-Pin Chiu
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L25/065 ; H01L23/13 ; H01L23/36 ; H01L23/498 ; H01L23/00
摘要：
Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include a substrate, a first die, and a second die coupled to the first die and the substrate. The substrate may include an opening. At least a portion of the die may occupy at least a portion of the opening in the substrate. Other embodiments including additional apparatuses and methods are described.
公开/授权文献
- US20140084441A1 STACKED-DIE PACKAGE INCLUDING DIE IN PACKAGE SUBSTRATE 公开/授权日：2014-03-27
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