- 专利标题: Semiconductor device and method of fabricating the same
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申请号: US15298746申请日: 2016-10-20
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公开(公告)号: US10008575B2公开(公告)日: 2018-06-26
- 发明人: Dong Chan Suh , Yong Suk Tak , Gi Gwan Park , Mi Seon Park , Moon Seung Yang , Seung Hun Lee , Poren Tang
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey, & Pierce, P.L.C.
- 优先权: KR10-2016-0010528 20160128
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L29/08 ; H01L29/66 ; H01L29/78 ; H01L23/528 ; H01L29/06
摘要:
A semiconductor device includes at least a first wire pattern, a gate electrode, a semiconductor pattern, a gate insulating layer, and a first spacer. The first wire pattern is on a substrate and isolated from the substrate. The gate electrode surrounds and intersects the first wire pattern. The semiconductor pattern is on both sides of the first wire pattern, and the semiconductor pattern includes a portion which overlaps the first wire pattern. The gate insulating layer is disposed between the gate electrode and the first wire pattern, and the gate insulating layer surrounds the first wire pattern. The first spacer is between the first wire pattern and the substrate, and the first spacer is between the gate insulating layer and the semiconductor pattern.
公开/授权文献
- US20170222006A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 公开/授权日:2017-08-03
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