Invention Grant
- Patent Title: Shield can assembly and electronic device having the same
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Application No.: US14671924Application Date: 2015-03-27
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Publication No.: US10010012B2Publication Date: 2018-06-26
- Inventor: Kyung-Ho Yoo , Jeong-Nam Cheon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2014-0035941 20140327
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K9/00 ; H05K1/02 ; H05K7/02
Abstract:
An electronic device is provided. The electronic device includes a printed circuit board, at least one electronic component disposed on the printed circuit board, a shield can disposed on the printed circuit board to shield the at least one electronic component, and at least one heat pipe disposed adjacent to at least a part of the shield can.
Public/Granted literature
- US20170251569A9 SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2017-08-31
Information query
