Invention Grant
- Patent Title: Interconnecting cooling units
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Application No.: US14746714Application Date: 2015-06-22
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Publication No.: US10010014B1Publication Date: 2018-06-26
- Inventor: Alan Joseph Lachapelle , Matthew Thomas Phillips
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Cooling units are configured to be installed in a datacenter, such as in a row configured to receive server racks. The cooling units include chilling coils configured to cool air passing across the chilling coil. The cooling units when installed supply cooled air. Units can be coupled together to expand cooling capacity, such as by forming a shared volume between adjacent units. Cooling provided through one or more coupled units can be controlled by another of the coupled units.
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