- Patent Title: Solder paste, joining method using the same and joined structure
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Application No.: US14697717Application Date: 2015-04-28
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Publication No.: US10010980B2Publication Date: 2018-07-03
- Inventor: Kosuke Nakano , Hidekiyo Takaoka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2009-203611 20090903
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B23K1/00 ; B23K35/26 ; C22C9/05 ; C22C9/06 ; C22C13/00 ; H01L23/00 ; H05K3/34 ; B23K35/36 ; B23K35/362 ; B23K101/40
Abstract:
A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.
Public/Granted literature
- US20150239069A1 SOLDER PASTE, JOINING METHOD USING THE SAME AND JOINED STRUCTURE Public/Granted day:2015-08-27
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