Invention Grant
- Patent Title: Injection molding die
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Application No.: US15023467Application Date: 2014-08-18
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Publication No.: US10011059B2Publication Date: 2018-07-03
- Inventor: Masaomi Hashimoto
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Saitama
- Agency: Wenderoth, Lind & Ponack L.L.P.
- Priority: JP2013-196639 20130924
- International Application: PCT/JP2014/071536 WO 20140818
- International Announcement: WO2015/045671 WO 20150402
- Main IPC: B29C45/73
- IPC: B29C45/73 ; B29C45/00 ; B22C9/06 ; B22D17/22 ; B29C45/04 ; B29C45/26 ; B29C45/40 ; B29C45/64 ; B29C45/72 ; B29L15/00

Abstract:
A movable mold includes a movable mold main body and a gear piece attached to the movable mold main body so as to relatively movable, and having a cavity formation space for forming a cavity. In the gear piece, a piece-side coolant flow path includes an annular flow path surrounding the cavity formation space, a piece-side supply flow path introducing coolant into the annular flow path, and a piece-side discharge flow path introducing the coolant from the annular flow path. The piece-side coolant flow path is connected to a movable mold main body-side supply flow path of the movable mold main body and a movable mold main body-side discharge flow path of the movable mold main body and the coolant flows therein under negative pressure generated by a coolant circulation device, so the inside of the cavity can be cooled effectively.
Public/Granted literature
- US20160207232A1 INJECTION MOLDING DIE Public/Granted day:2016-07-21
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