Invention Grant
- Patent Title: Fingerprint recognition apparatus
-
Application No.: US15204388Application Date: 2016-07-07
-
Publication No.: US10013596B2Publication Date: 2018-07-03
- Inventor: Hsiang-Yu Lee , Shang Chin , Ping-Tsun Lin
- Applicant: SUPERC-TOUCH CORPORATION
- Applicant Address: TW New Taipei
- Assignee: SUPERC-TOUCH CORPORATION
- Current Assignee: SUPERC-TOUCH CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: TW104124849A 20150731
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A fingerprint recognition apparatus includes an electrode-and-wiring substrate having two main surfaces opposite to each other, where one main surface is in proximity to user finger and the electrode-and-wiring substrate has a plurality of sensing electrodes on the other main surface. The fingerprint recognition apparatus further includes an integrated circuit (IC) chip having a fingerprint sensing circuit and a plurality of metal bumps. At least part of the metal bumps are electrically connected to the fingerprint sensing circuit and corresponding sensing electrodes on the electrode-and-wiring substrate, whereby the fingerprint sensing circuit is electrically connected to the sensing electrodes.
Public/Granted literature
- US20170098113A1 FINGERPRINT RECOGNITION APPARATUS Public/Granted day:2017-04-06
Information query