- Patent Title: Solid-state image pickup device and manufacturing method thereof
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Application No.: US15660436Application Date: 2017-07-26
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Publication No.: US10014350B2Publication Date: 2018-07-03
- Inventor: Keisuke Hatano , Tetsuji Yamaguchi , Shintarou Hirata
- Applicant: Sony Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2011-271195 20111212
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L27/30 ; H01L51/44 ; H01L51/00 ; H01L31/12 ; H01L27/146 ; H01L51/42
Abstract:
There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.
Public/Granted literature
- US20170323932A1 SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-11-09
Information query
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