- 专利标题: Silicon carbide semiconductor device having a trench with side walls and method for manufacturing same
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申请号: US14912433申请日: 2014-07-16
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公开(公告)号: US10014376B2公开(公告)日: 2018-07-03
- 发明人: Takeyoshi Masuda , Hideto Tamaso
- 申请人: Sumitomo Electric Industries, Ltd.
- 申请人地址: JP Osaka-shi
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka-shi
- 代理机构: Venable LLP
- 代理商 Michael A. Sartori; Kerri M. Patterson
- 优先权: JP2013-184813 20130906
- 国际申请: PCT/JP2014/068881 WO 20140716
- 国际公布: WO2015/033674 WO 20150312
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/16 ; H01L21/04 ; H01L29/423 ; H01L29/66 ; H01L29/04 ; H01L29/06
摘要:
A silicon carbide semiconductor device includes: a silicon carbide off substrate including a main surface having an off angle relative to a basal plane, the main surface being provided with a trench, the trench having a plurality of side walls and a bottom portion; a gate insulating film covering the side walls and the bottom portion; and a gate electrode provided on the gate insulating film, each of the side walls having an angle of more than 65° and not more than 80° relative to the basal plane in the trench, opening directions of the plurality of side walls being all at a silicon plane side or a carbon plane side.
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