Invention Grant
- Patent Title: Connector apparatus and communication system
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Application No.: US14914175Application Date: 2014-08-20
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Publication No.: US10014566B2Publication Date: 2018-07-03
- Inventor: Takahiro Takeda , Yasuhiro Okada
- Applicant: SONY CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JP2013-206093 20131001
- International Application: PCT/JP2014/071706 WO 20140820
- International Announcement: WO2015/049927 WO 20150409
- Main IPC: H01P5/08
- IPC: H01P5/08 ; H04B3/02 ; H03H7/38 ; H01P5/107 ; H04B5/00

Abstract:
A connector apparatus of the present disclosure is configured to include: a waveguide cable; a substrate including a waveguide structure; and a coupling section configured to electromagnetically couple an end portion of the waveguide cable to the waveguide structure. Furthermore, a communication system of the present disclosure is a communication system including: a transmitter configured to transmit high-frequency signals; a receiver configured to receive high-frequency signals; a waveguide cable configured to transmit high-frequency signals between the transmitter and the receiver; and a connector apparatus configured to connect between at least one of the transmitter and the receiver to the waveguide cable. A connector apparatus having the above-mentioned configuration is used as the connector apparatus.
Public/Granted literature
- US20160204495A1 CONNECTOR APPARATUS AND COMMUNICATION SYSTEM Public/Granted day:2016-07-14
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