- 专利标题: Manufacturing method of thermal module assembling structure
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申请号: US15060611申请日: 2016-03-04
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公开(公告)号: US10016859B2公开(公告)日: 2018-07-10
- 发明人: Sheng-Huang Lin , Kuo-Sheng Lin
- 申请人: ASIA VITAL COMPONENTS CO., LTD.
- 申请人地址: TW New Taipai
- 专利权人: ASIA VITAL COMPONENTS CO., LTD.
- 当前专利权人: ASIA VITAL COMPONENTS CO., LTD.
- 当前专利权人地址: TW New Taipai
- 代理机构: Jackson IPG PLLC
- 代理商 Demian K. Jackson
- 主分类号: B23P15/26
- IPC分类号: B23P15/26
摘要:
A manufacturing method of thermal module assembling structure includes a step of making a heat pipe received in a channel of a base seat tightly fitted and inserted in the channel by means of mechanical processing so as to integrally connect the base seat with the heat pipe. The manufacturing method of thermal module assembling structure is able to effectively enhance the connection strength between the base seat and the heat pipe.
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