Invention Grant
- Patent Title: Cu—Ga alloy sputtering target, and method for producing same
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Application No.: US14908346Application Date: 2014-07-25
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Publication No.: US10017850B2Publication Date: 2018-07-10
- Inventor: Yuuki Yoshida , Kouichi Ishiyama , Satoru Mori
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2013-160134 20130801
- International Application: PCT/JP2014/069735 WO 20140725
- International Announcement: WO2015/016153 WO 20150205
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C22C9/00 ; C22C1/04 ; C22C32/00 ; B22F3/16 ; B22F5/00 ; C23C14/14 ; H01J37/34

Abstract:
The present invention provides a sputtering target of a Cu—Ga sintered body in which the oxygen content is further reduced and the abnormal discharging can be suppressed, and a method for producing the same. The sputtering target according to the present invention is a sintered body having: a texture in which Na compound phases are dispersed in a matrix with a γ phase and a ζ phase of a Cu—Ga alloy; and a component composition made of: 20 atomic % to 30 atomic % of Ga; 0.05 atomic % to 10 atomic % of Na; and the Cu balance and inevitable impurities including elements other than Na in the Na compound, wherein an average grain size of the γ phase is 30 μm to 100 μm, and an average grain size of the Na compound phases is equal to or less than 8.5 μm.
Public/Granted literature
- US20160208376A1 CU-GA ALLOY SPUTTERING TARGET, AND METHOD FOR PRODUCING SAME Public/Granted day:2016-07-21
Information query
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