Invention Grant
- Patent Title: Dual-function wafer handling apparatus
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Application No.: US14513072Application Date: 2014-10-13
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Publication No.: US10018573B2Publication Date: 2018-07-10
- Inventor: Ming-Han Tsai , Sheng-Hsiang Chuang , Guan-Cyun Li , Yen-Ju Wei , Chiung-Min Lin , Yi-Ming Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G01N21/95
- IPC: G01N21/95
Abstract:
A dual-function wafer handling apparatus for handling a wafer includes an aligner for rotating the wafer, an ID reader disposed corresponding to an edge of the wafer for reading an ID of the wafer, and an optical defect inspection unit for capturing images to analysis.
Public/Granted literature
- US20160103080A1 DUAL-FUNCTION WAFER HANDLING APPARATUS Public/Granted day:2016-04-14
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