- 专利标题: Conductive polymer composite and substrate
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申请号: US14822551申请日: 2015-08-10
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公开(公告)号: US10020089B2公开(公告)日: 2018-07-10
- 发明人: Jun Hatakeyama , Koji Hasegawa , Takayuki Nagasawa
- 申请人: SHIN-ETSU CHEMICAL CO., LTD.
- 申请人地址: JP Tokyo
- 专利权人: SHIN-ETSU CHEMICAL CO., LTD.
- 当前专利权人: SHIN-ETSU CHEMICAL CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JP2014-181535 20140905; JP2015-135156 20150706
- 主分类号: H01B1/12
- IPC分类号: H01B1/12 ; C08L33/10 ; C08L25/08 ; C08L25/18 ; C08F12/08 ; C08F212/08 ; C08F8/36
摘要:
The present invention provides a conductive polymer composite including (A) a π-conjugated polymer and (B) a dopant polymer which contains a repeating unit “a” represented by the following general formula (1) and has a weight-average molecular weight in the range of 1,000 to 500,000, wherein R1 represents a hydrogen atom or a methyl group; R2 represents a fluorine atom or a trifluoromethyl group; Z represents a single bond or —C(═O)—O—; “m” is an integer of 1 to 4; and “a” is a number satisfying 0
公开/授权文献
- US20160071626A1 CONDUCTIVE POLYMER COMPOSITE AND SUBSTRATE 公开/授权日:2016-03-10
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