Invention Grant
- Patent Title: Coil component and method of manufacturing the same
-
Application No.: US15229587Application Date: 2016-08-05
-
Publication No.: US10020112B2Publication Date: 2018-07-10
- Inventor: Jong Sik Yoon , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0181757 20151218
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F27/255 ; H01F41/04 ; H01F41/10

Abstract:
A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.
Public/Granted literature
- US09978509B2 Coil component and method of manufacturing the same Public/Granted day:2018-05-22
Information query