- 专利标题: Resin substrate combined structure
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申请号: US15373545申请日: 2016-12-09
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公开(公告)号: US10021787B2公开(公告)日: 2018-07-10
- 发明人: Yoshihito Otsubo , Keisuke Araki , Yuki Ito , Kenji Kubota
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2014-128184 20140623
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H05K1/14 ; H05K1/02 ; H05K1/03 ; H05K1/18
摘要:
A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.
公开/授权文献
- US20170094793A1 RESIN SUBSTRATE COMBINED STRUCTURE 公开/授权日:2017-03-30
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