Invention Grant
- Patent Title: Resin substrate combined structure
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Application No.: US15373545Application Date: 2016-12-09
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Publication No.: US10021787B2Publication Date: 2018-07-10
- Inventor: Yoshihito Otsubo , Keisuke Araki , Yuki Ito , Kenji Kubota
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-128184 20140623
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/14 ; H05K1/02 ; H05K1/03 ; H05K1/18

Abstract:
A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.
Public/Granted literature
- US20170094793A1 RESIN SUBSTRATE COMBINED STRUCTURE Public/Granted day:2017-03-30
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