Invention Grant
- Patent Title: Transfer molding method, die structure, transfer molding device, and optical member
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Application No.: US14440644Application Date: 2013-02-08
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Publication No.: US10022897B2Publication Date: 2018-07-17
- Inventor: Isao Makuta , Koichi Takemura , Tomofusa Shibata , Yoshihisa Yamanaka , Norikazu Kitamura , Masayuki Shinohara , Kazuhide Hirota , Toshikaga Taguchi , Masayuki Kojima , Yukihiro Takahashi
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha Liang LLP
- Priority: JP2012-244004 20121105
- International Application: PCT/JP2013/053101 WO 20130208
- International Announcement: WO2014/069002 WO 20140508
- Main IPC: B29C43/02
- IPC: B29C43/02 ; B29C59/02 ; B44C1/17 ; F21V8/00 ; B29L11/00
Abstract:
A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.
Public/Granted literature
- US20150251341A1 TRANSFER MOLDING METHOD, DIE STRUCTURE, TRANSFER MOLDING DEVICE, AND OPTICAL MEMBER Public/Granted day:2015-09-10
Information query
