Invention Grant
- Patent Title: Methods of manufacturing semiconductor devices using a composition for removing photoresist and methods of removing photoresist from a semiconductor substrate
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Application No.: US15084536Application Date: 2016-03-30
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Publication No.: US10025192B2Publication Date: 2018-07-17
- Inventor: Jung-Min Oh , Mi-Hyun Park , Hyo-San Lee , Ji-Hoon Jeong , Yong-Sun Ko , In-Gi Kim , Na-Rim Kim , Sang-Tae Kim , Seong-Min Kim , Kyong-Ho Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do KR Pyeongtaek-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,DONGWOO FINE-CHEM
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,DONGWOO FINE-CHEM
- Current Assignee Address: KR Suwon-si, Gyeonggi-do KR Pyeongtaek-si, Gyeonggi-do
- Agency: Lee & Morse P.C.
- Priority: KR10-2015-0059184 20150427
- Main IPC: G03F7/42
- IPC: G03F7/42 ; H01L21/8238 ; H01L21/266 ; H01L29/16 ; H01L21/311
Abstract:
A composition for removing photoresist, including an alkyl ammonium fluoride salt in an amount ranging from about 0.5 weight percent to about 10 weight percent, based on a total weight of the composition; an organic sulfonic acid in an amount ranging from about 1 weight percent to about 20 weight percent, based on the total weight of the composition; and a lactone-based solvent in an amount ranging from about 70 weight percent to about 98.5 weight percent, based on the total weight of the composition.
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