- 专利标题: Method and apparatus for inductive coupling signal transmission
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申请号: US15221346申请日: 2016-07-27
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公开(公告)号: US10027381B2公开(公告)日: 2018-07-17
- 发明人: Ken Iwakura
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Dorsey & Whitney LLP
- 主分类号: H04B5/00
- IPC分类号: H04B5/00 ; H01L49/02 ; H01L25/11
摘要:
Method and Apparatuses for of transmitting data between semiconductor chips are described. An example apparatus includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes first and second inductors. The first semiconductor chip transmits a first combination of a plurality of data bits in logical value by flowing a first current through the first inductor and by flowing substantially no current through the second inductor. The second semiconductor chip includes third and fourth inductors that correspond respectively to the first and second inductors of the first semiconductor chip. The second semiconductor chip receives the first combination of the plurality of data bits in logical value by detecting an electromotive force at the third inductor responsive to the first current and by detecting substantially no electromotive force at the fourth inductor responsive to no current.
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