- 专利标题： Connector, circuit board module and circuit board module array including same
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申请号： US15120210申请日： 2015-02-13
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公开(公告)号： US10028383B2公开(公告)日： 2018-07-17
- 发明人: Jun Seok Park
- 申请人： LG INNOTEK CO., LTD.
- 申请人地址： KR Seoul
- 专利权人： LG INNOTEK CO., LTD.
- 当前专利权人： LG INNOTEK CO., LTD.
- 当前专利权人地址： KR Seoul
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： KR10-2014-0020291 20140221
- 国际申请： PCT/KR2015/001450 WO 20150213
- 国际公布： WO2015/126101 WO 20150827
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/14 ; H01R12/72 ; H01R12/73 ; H05K3/36 ; H05K3/34 ; H01L33/62 ; H01R24/84 ; H01R103/00 ; H05K1/18
摘要：
In one embodiment, provided is a connector comprising: a body; a first protrusion formed on a first surface of the body; a first groove formed on the first surface of the body to be adjacent to the first protrusion, and of which the shape includes the inverse of the first protrusion; a first terminal of which at least a portion is arranged to correspond to the first protrusion; and a second terminal of which at least a portion is arranged to correspond to the first groove.
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