- 专利标题： Semiconductor package and fabricating method thereof
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申请号： US15447831申请日： 2017-03-02
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公开(公告)号： US10037949B1公开(公告)日： 2018-07-31
- 发明人: Hee Sung Kim , Yeoung Beom Ko , Dae Byoung Kang , Jae Jin Lee , Joon Dong Kim , Dong Jean Kim
- 申请人： Amkor Technology, Inc.
- 申请人地址： US AZ Tempe
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Tempe
- 代理机构： McAndrews, Held & Malloy, Ltd.
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/78 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L23/31 ; H01L25/16
摘要：
A semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate, encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant.
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