Invention Grant
- Patent Title: Polishing apparatus
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Application No.: US15166163Application Date: 2016-05-26
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Publication No.: US10040163B2Publication Date: 2018-08-07
- Inventor: Sungwoo Eo , Hyunchul Jung
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2015-0123039 20150831
- Main IPC: B24B29/04
- IPC: B24B29/04

Abstract:
A polishing apparatus includes a jig unit including a substrate supporting part having a placing surface on which a substrate having a first curvature is placed. The placing surface has a second curvature corresponding to the first curvature and a polishing unit includes at least one polishing part to be rotated to polish a process surface of the substrate. The process surface of the curved substrate may be uniformly polished and foreign substances generated during the polishing process are prevented from entering into the substrate.
Public/Granted literature
- US20170057047A1 POLISHING APPARATUS Public/Granted day:2017-03-02
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