Invention Grant
- Patent Title: Touch-sensitive module
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Application No.: US15700464Application Date: 2017-09-11
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Publication No.: US10042499B2Publication Date: 2018-08-07
- Inventor: Shih-Hsien Hu , Yi-Feng Wei , Yao-Chih Chuang
- Applicant: Touchplus Information Corp.
- Applicant Address: TW New Taipei
- Assignee: TOUCHPLUS INFORMATION CORP.
- Current Assignee: TOUCHPLUS INFORMATION CORP.
- Current Assignee Address: TW New Taipei
- Agency: WPAT, PC
- Priority: TW103105166 20140217
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G05G9/047 ; G06F3/0338 ; G06F3/0354

Abstract:
A touch-sensitive module is provided. The touch-sensitive module includes at least one first sub-unit. The first sub-unit includes a first sensor pad, a second sensor pad and a wrapper. The second sensor pad has a first portion and a second portion separated from each other. The first sensor pad passes through a gap between the first portion and the second portion of the second sensor pad. Two ends of a wire are electrically connected to the first portion and the second portion of the second sensor pad, respectively. The wrapper covers the first sensor pad and the second sensor pad. A first lead and a second lead connected to the first sensor pad protrude from the wrapper. A third lead and a fourth lead connected to the second sensor pad protrude from the wrapper.
Public/Granted literature
- US20170371456A1 TOUCH-SENSITIVE MODULE Public/Granted day:2017-12-28
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