Invention Grant
- Patent Title: Chip card module, chip card and method of forming a chip card module
-
Application No.: US15477128Application Date: 2017-04-03
-
Publication No.: US10043126B2Publication Date: 2018-08-07
- Inventor: Walther Pachler , Stephan Rampetzreiter
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner mbB
- Priority: DE102016107982 20160429
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; H01L23/66 ; H01L23/00 ; H01L25/04 ; H01L49/02

Abstract:
In various embodiments, a chip card module for a chip card is provided. The chip card module may include a carrier with a first side and an opposite second side, a chip arranged over the first side of the carrier, an antenna arranged over the carrier. The antenna may be electrically conductively coupled to the chip and configured to inductively couple to a second antenna formed on a chip card body of the chip card. The chip card module may further include a capacitor electrically conductively coupled to the chip, the capacitor including a first electrode arranged over the first side of the carrier, and a second electrode arranged over the second side of the carrier.
Public/Granted literature
- US20170316303A1 CHIP CARD MODULE, CHIP CARD AND METHOD OF FORMING A CHIP CARD MODULE Public/Granted day:2017-11-02
Information query