Invention Grant
- Patent Title: Chip on film package
-
Application No.: US15336821Application Date: 2016-10-28
-
Publication No.: US10043737B2Publication Date: 2018-08-07
- Inventor: Wen-Ching Huang , Tai-Hung Lin
- Applicant: Novatek Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: Novatek Microelectronics Corp.
- Current Assignee: Novatek Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Jciprnet
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L23/36 ; H01L23/498 ; H01L21/48 ; H01L23/00
Abstract:
A chip on film package includes a base film, a chip and a heat-dissipation sheet. The base film includes a first surface. The chip is disposed on the first surface and having a chip length along a first axis of the chip. The heat-dissipation sheet includes a covering portion and a first extending portion connected to the covering portion and attached to first surface. The covering portion at least partially covers the chip and having a first length along the first axis. The first extending portion has a second length along the first axis substantially longer than the first length of the covering portion, and the covering portion exposes a side surface of the chip, wherein the side surface connects a top surface and a bottom surface of the chip.
Public/Granted literature
- US20170162487A1 CHIP ON FILM PACKAGE Public/Granted day:2017-06-08
Information query
IPC分类:
