Invention Grant
- Patent Title: CMOS-MEMS structure and method of forming the same
-
Application No.: US15457498Application Date: 2017-03-13
-
Publication No.: US10046965B2Publication Date: 2018-08-14
- Inventor: Jung-Huei Peng , Chia-Hua Chu , Fei-Lung Lai , Shiang-Chi Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: B81C1/00
- IPC: B81C1/00

Abstract:
The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.
Public/Granted literature
- US20170183222A1 CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2017-06-29
Information query