- Patent Title: Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
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Application No.: US15468977Application Date: 2017-03-24
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Publication No.: US10047213B2Publication Date: 2018-08-14
- Inventor: Hiroaki Fujiwara , Yuki Kitai , Hirosuke Saito
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2013-023572 20130208
- Main IPC: C08K5/378
- IPC: C08K5/378 ; C08G73/02 ; C08K5/3445 ; C08L79/02 ; C08J5/24 ; B32B15/14 ; H05K1/03 ; H01L23/29
Abstract:
A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.
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