- Patent Title: Sensor module and motion assistance apparatus including the same
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Application No.: US15083541Application Date: 2016-03-29
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Publication No.: US10048140B2Publication Date: 2018-08-14
- Inventor: Hyun Do Choi , Seungyong Hyung , Jeonghun Kim , Se-Gon Roh , Minhyung Lee , Youn Baek Lee , Jongwon Lee , Byungjune Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co, Ltd.
- Current Assignee: Samsung Electronics Co, Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2015-0123089 20150831
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01L5/22 ; G01L1/00 ; G01L1/16 ; G01L1/18 ; G01L1/20 ; G01L1/24
Abstract:
Provided is a sensor device including a receiving body including an inserting space, an inserting body disposed in the inserting space, a first sensor assembly including at least one sensor provided between an inner surface of the receiving body and an outer surface of the inserting body, and a second sensor assembly including at least one sensor provided between another inner surface of the receiving body and another outer surface of the inserting body.
Public/Granted literature
- US20170059422A1 SENSOR MODULE AND MOTION ASSISTANCE APPARATUS INCLUDING THE SAME Public/Granted day:2017-03-02
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