- 专利标题: Submicron wafer alignment
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申请号: US15188717申请日: 2016-06-21
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公开(公告)号: US10048473B2公开(公告)日: 2018-08-14
- 发明人: Todor Georgiev Georgiev
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理机构: Knobbe, Martens, Olson & Bear, LLP
- 主分类号: G02B13/00
- IPC分类号: G02B13/00 ; G01B11/14 ; H01L27/146 ; G02B7/00 ; B32B7/00 ; G02B27/62 ; G02B27/32 ; G02B27/14 ; G02B27/10
摘要:
Certain aspects relate to systems and techniques for submicron alignment in wafer optics. One disclosed method of alignment between wafers to produce an integrated lens stack employs a beam splitter (that is, a 50% transparent mirror) that reflects the alignment mark of the top wafer when the microscope objective is focused on the alignment mark of the bottom wafer. Another disclosed method of alignment between wafers to produce an integrated lens stack implements complementary patterns that can produce a Moiré effect when misaligned in order to aid in visually determining proper alignment between the wafers. In some embodiments, the methods can be combined to increase precision.
公开/授权文献
- US20170038562A1 SUBMICRON WAFER ALIGNMENT 公开/授权日:2017-02-09
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