Invention Grant
- Patent Title: Submicron wafer alignment
-
Application No.: US15188717Application Date: 2016-06-21
-
Publication No.: US10048473B2Publication Date: 2018-08-14
- Inventor: Todor Georgiev Georgiev
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: G02B13/00
- IPC: G02B13/00 ; G01B11/14 ; H01L27/146 ; G02B7/00 ; B32B7/00 ; G02B27/62 ; G02B27/32 ; G02B27/14 ; G02B27/10

Abstract:
Certain aspects relate to systems and techniques for submicron alignment in wafer optics. One disclosed method of alignment between wafers to produce an integrated lens stack employs a beam splitter (that is, a 50% transparent mirror) that reflects the alignment mark of the top wafer when the microscope objective is focused on the alignment mark of the bottom wafer. Another disclosed method of alignment between wafers to produce an integrated lens stack implements complementary patterns that can produce a Moiré effect when misaligned in order to aid in visually determining proper alignment between the wafers. In some embodiments, the methods can be combined to increase precision.
Public/Granted literature
- US20170038562A1 SUBMICRON WAFER ALIGNMENT Public/Granted day:2017-02-09
Information query