发明授权
- 专利标题： Printed circuit board with coextensive electrical connectors and contact pad areas
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申请号： US14684619申请日： 2015-04-13
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公开(公告)号： US10051733B2公开(公告)日： 2018-08-14
- 发明人: Chih-Chin Liao , Han-Shiao Chen , Chin-Tien Chiu , Ken Jian Ming Wang , Cheeman Yu , Hem Takiar
- 申请人： SanDisk Technologies Inc.
- 申请人地址： US TX Plano
- 专利权人： SanDisk Technologies Inc.
- 当前专利权人： SanDisk Technologies Inc.
- 当前专利权人地址： US TX Plano
- 代理机构： Vierra Magen Marcus LLP
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H05K1/11 ; H05K1/02 ; H05K1/18 ; H05K3/40 ; H05K3/42
摘要：
A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads.
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