Invention Grant
- Patent Title: Foamed sole and shoe
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Application No.: US14373002Application Date: 2012-01-18
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Publication No.: US10051915B2Publication Date: 2018-08-21
- Inventor: Yasuhiro Otsuka , Kenichi Harano , Takuro Kamimura , Daisuke Sawada
- Applicant: Yasuhiro Otsuka , Kenichi Harano , Takuro Kamimura , Daisuke Sawada
- Applicant Address: JP
- Assignee: ASICS Corporation
- Current Assignee: ASICS Corporation
- Current Assignee Address: JP
- Agency: Katten Muchin Rosenman LLP
- International Application: PCT/JP2012/050934 WO 20120118
- International Announcement: WO2013/108378 WO 20130725
- Main IPC: A43B13/18
- IPC: A43B13/18 ; A43B13/04 ; A43B13/12

Abstract:
A foamed sole according to the present invention includes a foam molding containing a rubber component and a resin component, wherein the maximum value of a loss factor [tan δ] at a frequency of 10 Hz and at 30° C. to 80° C. of the foam molding is 0.18 or less, and a peak of a loss factor [tan δ] at a frequency of 10 Hz of the foam molding lies within the range of 100° C. or higher. The foamed sole has a feature that it hardly shrinks when it is heated.
Public/Granted literature
- US20150181975A1 Foamed Sole and Shoe Public/Granted day:2015-07-02
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