- Patent Title: B-stage film adhesive compatible with aqueous ink for printhead structures interstitial bonding in high density piezo printheads fabrication for aqueous inkjet
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Application No.: US15410058Application Date: 2017-01-19
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Publication No.: US10052874B2Publication Date: 2018-08-21
- Inventor: Yanjia Zuo , Mandakini Kanungo , Hong Zhao , Pratima Gattu Naga Rao , Mark A. Cellura , Santokh S. Badesha , John R. Andrews
- Applicant: XEROX CORPORATION
- Applicant Address: US CT Norwalk
- Assignee: XEROX CORPORATION
- Current Assignee: XEROX CORPORATION
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed using conventional techniques are known to gain weight and squeeze out when exposed to certain inks such as ultraviolet inks, solid inks, and aqueous inks. An embodiment of the present teachings can include processing of a particular adhesive such that the resulting epoxy adhesive is suitable for printhead applications.
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