Invention Grant
- Patent Title: Coil component and board having the same
-
Application No.: US14621282Application Date: 2015-02-12
-
Publication No.: US10056183B2Publication Date: 2018-08-21
- Inventor: Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0122873 20140916
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/02 ; H01F17/00 ; H01F1/34

Abstract:
There are provided a coil component and a board having the same. The coil component may include: a magnetic body including a substrate having two cores, first and second coil parts disposed on one surface of the substrate, and third and fourth coil parts disposed on the other surface of the substrate; a connection part disposed to penetrate through the two cores in the magnetic body and connecting the two cores to each other; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil parts.
Public/Granted literature
- US20160078994A1 COIL COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2016-03-17
Information query